The award held in Taipei, Taiwan was won through its Ultra Mobile Platform, according to the chief executive, VIA Technologies, Mr. Wenchi Chen, for its power efficient design.
He explained that the UMP was made up of 1Gega Hertz (GHz) VIA C7-M ULV processor and VIA VX700 mobile system media processor, the all-in-one digital media IGP chipset.
Also, the VIA Ultra Mobile Platform was chosen for its rich media integration and significant platform size reduction, just as the VIA Ultra Mobile Platform for Ultra Mobile Devices (UMDs) could be found inside many ultra mobile products on display at this year’s show.
Deputy Director of CPU Product Marketing, VIA Technologies Incorporated, Epan Wu expressed the company’s delight to be recognized for its innovative work in designing ultra power efficient mobile processors and highly integrated chipsets.
“It’s good to have our goal of being the platform of choice for Mobility 2.0 validated by the judges of this prestigious ICT trade show,” Wu said.
The director said that mobility 2.0 would go beyond today’s limited mobile Internet to a full-featured Web 2.0 browsing and computing experience at the fingertips through the next generation of Ultra Mobile Devices (UMDs).
The device, according to him, weighs less a kilogramme, and based on the x86 architecture, while bridging the gap between the notebook and the mobile phone, as well as bringing the benefits of a PC with all the applications, information and entertainment users require to an ultra portable handheld form factor.
The Deputy Director added that the VIA Ultra Mobile Platform is the leading choice for companies producing UMDs with more VIA based designs available to consumers on the market today.
CompuTex 2007, the acclaimed world’s second largest and the region’s most important ICT exhibition cum trade show, took place between June 5 and 9 at the Taipei World Trade Centre.
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